Разъем SIM-карты, PUSH PUSH, 8P+1P, H=1,9 мм, без стойки

1.FINISH:
1.1 CONTACT:50U"MIN NICKEL UNDER PLATED15U"MIN GOLD PLATING ON CONTACTAREA,100U'MATTE PLATING ON SOLDERING AREA
1.2 SHELL:
5OU"NICKEL UNDER PLATED,2U"MIN GOLD PLATING ON SOLDERING AREA.
1.3 DETECT PIN:50u"MIN NICKEL UNDER PLATED,SU"MIN GOLD PLATING ON CONTACTAREA.10OU"MATTE PLATING ON SOLDERING AREA
2.SOLDER TAIL COPLANARITY:0.08MM MAX
3. COMPLIANCE WITH HSF DIRECTIVE
4.MAXIMAL TOTAL HEIGHT WHEN INSERTING SIM CARD ,NEED AVOID THIS AREA
5.SPECIALITY:
5.1 RATED CURRENT:0.5A
5.2 RATED VOLTAGE:12V
5.3 CONTACT RESISTANCE:50mΩ MAX
5.4 INSULATION RESISTANCE1000MQ MIN 500V DC
5.5 DIELECTRIC WITHSTANDING VOLTAGE:50OV AC.
5.6 OPERATING CONDITION:TEMPERATURE-40°C~+85°C:
HUMIDITY'80% R.H MAX
6.MFTALMASK THICKNFSS O.10MM MIN