Разъем SIM-карты, PUSH PUSH, 6P+2P, H=2,2 мм, со штифтом

NOTES:
1.MATERIAL:
HOUSING: High Temperature Thermoplastic
Terminal:copper Alloy
Shell: Stainless Steel
2.PLATING:
Terminal:50u" Ni UNDERPLATED OVERALL
G/F PLATED ON CONTACT AREA
100u" Tin PLATED ON SOLDER AREA
Sheel:50u" Ni UNDERPLATED OVERALL
G/F PLATED ON CONTACT AREA AND SOLDER AREA
3.TECHNICAL SPECIALITY:
RATED VOLTAGE: 30V AC MAX
CURRENT RATING:0.5A MAX.
INSULATION RESISTANCE:1000MΩ MIN
CONTACT REISTANCE:50mΩ MAX
WITHSTANDING VOLTAGE:500V AC FOR 1 MINUTES
OPERATING TEMPERATURE: -40°C~+85°C Humidity 80% R.H MAX