Разъем SIM-карты, PUSH PUSH, 6P+2P, H=1,8 мм, без стойки, MUP C760

MATERIAL:
Insulator: High Temperature Thermoplastic, UL 94V-0.
Contact: Copper Alloy
CD PIN: Copper Alloy
Shell: STAINLESS
PLATING:
Contact: Plated Ni , contact point gold plated G/F, welding feet Matte tin
Shell: Plated Ni Overall Plated G/F Selective Contact Area
CD PN: Plated Ni, tin feet, contact point brush gold
Electrical:
Current Rating :0.5A AC/DC max.
Voltage Rating :50V AC/DC
Ambient Temperature Range :-20°C~+60°C
Storage Temperature Range :-40°C~+70°C
Ambient Humidity Range :95% R.H. Max.
Contact Resistance:100mΩmax.
Insulation Resistance:1000MΩmin./500VDC
Mating Cycles:5,000 insertions
Temperature: 260°C±5°