Разъем SIM-карты, PUSH PUSH, 6P+2P, H=1,8 мм, со штифтом, MUP-C760

NOTES:
1)MATERIAL:
HOUSING: HIHGT TEMPERATURE THERMOPLASTIC
CONTACT: COPPER ALLOY
SHELL: STEEL
2)FINISH :
CONTACT:GOLD FLASH PLATED ON CONTACT AREA;
MATTE-TIN PLATED ON SOLDER TAILS; WITH
ENTIRE CONTACT UNDERPLATED NICKEL.
SHELL: GOLD FLASH PLATED ON SOLDER TAILS
3.INFRARED REFLOW SOLDERING: 10sec. Min. at 260