Разъем SIM-карты, PUSH PUSH, 6P+1P, H=2.0 мм, со штифтом

1.MATERIAL:
HOUSING: High Temperature Thermoplastic
Terminal:copper Alloy
Shell: Stainless Steel
2.PLATING:
Terminal:40u" Ni UNDERPLATED OVERALL
G/F PLATED ON CONTACT AREA AND SOLDER AREA
Sheel:30u" Ni UNDERPLATED OVERALL
G/F PLATED ON CONTACT AREA AND SOLDER AREA
3.TECHNICAL SPECIALITY:
RATED VOLTAGE: 30V AC MAX
CURRENT RATING: 0.5A MAX.
INSULATION RESISTANCE:1000MΩ MIN
CONTACT REISTANCE:50mΩMAX
WITHSTANDING VOLTAGE: 500V AC FOR 1 MINUTES
OPERATING TEMPERATURE:-40℃~+85℃ Humidity 80% R.H MAX