Разъем SIM-карты, раскладной тип, 6P, H=2,5 мм, MUP C713

A.Material:
1.insulator:High temperature thermoplasticUL94V-0,(BLACK LCP)
2.Pho.Bronze:Plating,
50U" MIN NICKEL UNDERPLATED;3-8U" GOLD ON THE CONTACT AREA,100U" TIN PLATING ON SOLDER TAIL
B.Electrical specifications:
Voltage rating: 10 V AC
Current rating: 0.5A
Dielectric strength: 500V AC for 1minute min
Insulation resistance: 1000 M ohm
Contact resistance:100 mill.ohm max
Operation temperature: -25°C to +95°C
Product withstanding rff lowsoldering 260'c for 10s
C.Mechanical specieications.
3.1 Durability: 5000 cycles