Разъем для карты Nano SIM, PUSH PULL, 6P+1P, H=1,4 мм, без стойки

1.MATERIAL:
HOUSING:High Temperature Thermoplastic
Terminal:copper Alloy
Shell:Stainless Steel
2.PLATING:
Terminal:50u" Ni UNDERPLATED OVERALLG/F PLATED ON CONTACT AREA AND SOLDER AREA
Sheel:50u" Ni UNDERPLATED OVERALL
3.TECHNICAL SPECIALITY:
RATED VOLTAGE:30VACMAX
CURRENT RATING:0.5AMAX.
INSULATION RESISTANCE:1000MΩ MIN
CONTACT REISTANCE:100mΩ MAX
WITHSTANDING VOLTAGE:500VACF
ORIMINUTESOPERATING TEMPERATURE:-40℃~+85℃