Разъем для карты Micro SIM, PUSH PUSH, H=1,29 мм, без стойки, molex

NOTES:
MATERIAL:
Housing: High Temperature Thermoplastic,
Contact: copper Alloy
Shell: Sus
PLATING:
Contact: Contact Area:Au 1u",
Solder area: Gold FlashUnder plate Ni 40u"Min all over
Shell: Plated 30u" Ni Overall
Solder area: Gold Flash
Electrical:
Current Rating :0.5mA max.
Voltage Rating :50V DC MAX
Ambient Temperature Range :-20°C~+85°C
Storage Temperature Range :-40°C~+70°C
Ambient Humidity Range :95% R.H. Max.
Contact Resistance:100mmax.
Insulation Resistance:1000M Q min./250VDC
Dielectric Withstanding Voltage:500V AC
Mating cycles:3,000insertions
Temperature:260℃±5°