Разъем для микро-SIM-карты, PUSH PUSH, 8P+1P, H=1,5 мм, без стойки

1.SPECIALITY:
1.1 Rated current:1.0A
1.2 Rated voltage:30V
1.3 Contact Resistance:50mΩ MAX
1.4 Insulation Resistance:1000MΩ MIN 500V DC
1.5 Dielectric withstanding voltage: 500V AC
1.6 Solder ability:250±5℃,5±0.5s.
1.7 Durability:5000 Cycles Min.
1.8 Operating condition:Temperature-40℃~+85°C;
Humidity 80% R.H MAX