Разъем для микро-SIM-карты, PUSH PUSH, 6P, H=1,35 мм, без стойки

MATERIAL:
Insulator: High Temperature Thermoplastic,
Contact: copper Alloy
ShelL: STAINLESS
PLATING:
Contact: Plated 30u" Ni Overall ,
Solder Area: Tin,contact G/F
Shell: Plated 30u' Ni Overall
Plated G/F Selective contact Area
Electrical:
Current Rating :0.5A AC/DC max.
Voltage Rating :50V AC/DC MAX
Ambient Temperature Range :-20°C~+85°C
Storage Temperature Range :-40°C~+70°C
Ambient Humidity Range :95% R.H. Max.
Contact Resistance:100mΩmax.
Insulation Resistance:1000M min./250V DC
Dielectric Withstanding Voltage:500V AC
Mating cycles:5,000 insertions
Temperature: 260°C±5°