Разъем для карты Micro SIM, PUSH PUSH, 6P+1P, H=1,25 мм, без стойки

MATERIAL:
Insulator: High Temperature Thermoplastic
Contact: copper Alloy
ShelL: STAINLESS
PLATING:
Contact: Plated 30u" Ni Overall ,Solder Area: Tin,Contact G/F
Shell: Plated 30u" Ni Overall
Plated G/F Selective Contact Area
Electrical:
Current Rating :0.5mA max.
Voltage Rating :50V DC MAX
Ambient Temperature Range :-20°C~+85°C
Storage Temperature Range :-40°C~+70°C
Ambient Humidity Range :95% R.H. Max.
Contact Resistance:100mΩmax.
Insulation Resistance:1000MΩmin./250V 
DCDielectric Withstanding Voltage:500V AC
Mating Cycles:5,000 Insertions
Temperature: 260°C +5°