Разъем для карты Micro SIM, PUSH PULL, 6P, H=2,4 мм, без стойки

NOTES:
1.MATERIAL:
HOUSING:HI-TEMP.PLASIC UL 94V-0
CONTACT:COPPER ALLOY
SHELL:STANLESS STEEL
2.PLATING:
TERMINAL:
CONTACT AREA: AU GOLD FLASH.
SOLDER AREA: AU GOLD FLASH.
UNDER PLATE: NICKEL.
SHELL: NICKEL PLATED OVER ALL.
SOLDER AREA: GOLD FLASH.
3.SPECIALITY:
3.1 Rated current:1.0A
3.2 Rated voltage:30V
3.3 Contact Resistance:50mΩ MAX
3.4 Insulation Resistance:1000MQ MIN 500V DC
3.5 Dielectric withstanding voltage: 500V AC.
3.6 Solder ability:260+0/-5℃,30+10s.
3.7 Durability:5000 cycles Min.
3.8 0perating condition:Temperature-40℃~+85℃: