Разъем для карты Micro SIM, PUSH PULL, 6P, H=2,45 мм, без стойки

MATERIAL:
Insulator: High Temperature Thermoplastic, UL 94V-0
Contact:C5210
SHELL:SUS
PLATING:
Contact: Plated 50u' Ni Overa Contact Au lu,Pad Au lu
Sel1: Plated 50u" Ni Overall,Pad Au lu
Electrical:
Current Rating :0.5mA AC/DC max.
Voltage Rating:125V AC/DC
Ambient Temperature Range :-40°C~+85°C
Storage Temperature Range :-40°C~+85°C
Ambient Humidity Range :95% R.H Max.
Contact Resistance:100mΩmax.
Insulation Resistance:1000Mmin./500VDC
Mating cycles:10,000 insertions
Reflow peak temp.: 260°C士5°C，3~5 S
Mating Cycles:5,000 Insertions Min